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CAPABILITY
FPC Manufacture Capabilities
FPC Manufacture Capabilities
| Item | Standard | Advanced | Comment | |
| Material | FCCL(adhesive) | Shengyi SF305: PI=0.5mil&1mil&2mil; Cu=0.33oz/0.5oz/1oz | / | |
| FCCL(adhesiveless) | Panasonic R-F775: PI=1mil&2mil&3mil; Cu=0.5oz/1oz | PI=3mil Cu=2oz | ||
| Taiflex MHK: PI=1mil&2mil; Cu=0.33oz/0.5oz/1oz | ||||
| DuPont Pyralux AP: PI=1mil&2mil&3mil; Cu=0.5oz/1oz | PI=4mil Cu=2oz | |||
| Coverlay | Shengyi SF305C: 0515 &0525 &1025 &2030 | / | ||
| Taiflex FHK:1025& 2035 | / | |||
| Adhesive | Taiflex BT: AD=10um &25um &40um | / | ||
| PI stiffener | Taiflex MHK: PI=3mil &5mil &7mil &9mil | / | ||
| 3M | 9077& 6677 & 9058 | / | ||
| others | Design software | CAM350&PROTEL&PAD&POWERPCB&GENESIS&AUTOCAD&ORCAD | / | |
| Gerber format | RS-274-D ,RS-274-X | / | ||
| Drill format | EXCELLON Format | / | ||
| Layer | 1--4 | 5--10 | ||
| Board thickness (without stiffener) | 0.05--0.5mm | 0.5--0.9mm | ||
| Tolerance of single layer | ±0.03mm | ±0.03mm | without stiffener | |
| Tolerance of double-layer (≤ 0.3mm) | ±0.03mm | ±0.03mm | without stiffener | |
| Tolerance of multi-layer (< 0.3mm) | ±0.03mm | ±0.03mm | without stiffener | |
| Tolerance of multi-layer (0.3mm-0.9mm) | ±0.05mm | ±10% | without stiffener | |
| Tolerance of board thickness (including PI stiffener) | ±0.05mm | ±10% | ||
| Tolerance of board thickness (including FR4 stiffener) | ±0.1mm | ±10% | ||
| Min. board size | 5*10mm(without bridge);10*10mm(with bridge) | 4*8mm(without bridge);8*8mm(with bridge) | ||
| Max. board size | 9 * 14 inch | 9 * 28 inch(PI≥1mil) | ||
| impedance control tolerance | Single-ended:±5Ω(50≤Ω) ±10%(>50Ω) | Single-ended:±3Ω(50≤Ω) ±8%(>50Ω) | ||
| Differential:±5Ω(50≤Ω) ±10%(>50Ω) | Differential:±4Ω(50≤Ω) ±8%(>50Ω) | |||
| Min. coverlay bridge | 8mil | / | ||
| Min. bend radius single layer | 3--6 times of board thickness | / | ||
| Min. bend radius double- layer | 6--10 times of board thickness | / | ||
| Min. bend radius multi- layer | 10--15 times of board thickness | / | ||
| Min. dynamic bend radius | 20--40 times of board thickness | / | single layer | |
| Inner layer | Min. line width/spacing (12/18um copper) | 3/3.2mil(loop lines 6/6.2mil) | 2.8/2.7mil(loop lines 5/5.2mil) | |
| Min. line width/spacing (35um copper) | 4/4mil(loop lines 8/8mil) | 3.5/3.5mil(loop lines 7/7mil) | ||
| Min. line width/spacing (70um copper) | 6/6.5mil(loop lines 10/10.5mil) | 5/6mil(loop lines 9/9.5mil) | ||
| Max. copper thickness | 2oz | 3oz | ||
| Outer layer | Min. line width/spacing (18um copper) | 3/3.2mil(loop lines 6/6mil) | 2.8/2.7mil(loop lines 5.5/5.5mil) | |
| Min. line width/spacing (35um copper) | 4/4.5mil(loop lines 8/8.5mil) | 3.5/3.5mil(loop lines 7.5/7.5mil) | ||
| Min. line width/spacing (70um copper) | 6/7mil(loop lines 10/11mil) | 5.5/8.5mil(loop lines 9.5/10mil) | ||
| Min. line width/spacing (105um copper) | 10/13mil(loop lines 12/15mil) | 9.5/12.5mil(loop lines 11.5/14.5mil) | ||
| Max. finished copper thickness | 3oz | 5oz | ||
| Drilling | Min. distance between via and conductors | 6mil(< 4 layers) | 5mil(< 4 layers) | |
| 8mil( 4--6 layers) | 7mil( 4--6 layers) | |||
| 12mil( 7--8 layers) | 10mil(7--8 layers) | |||
| Min. mechanical drill hole | 6mil | 4mil | ||
| Solder mask&silk screen | Solder mask color | green | / | |
| Min. solder dam(base copper ≤ 1oz ) | 4mil(green),8mil(solder dam on the large copper) | / | ||
| Min. clearance | 3 mil (prat for 2.5mil) | / | ||
| Silk color | White,Yellow | / | ||
| Surface treatment | Surface treatment | HASL,ENIG,ENEPIG,Electrolytic Nickel Gold,Soft gold,Hard gold,Immersion silver and OSP | Immersion tin | |
| Mixed surface treatment | ENIG+0SP; ENIG+G/F | / | ||
| Gold thickness (ENIG) | 0.05--0.1um | / | ||
| Nickel thickness(ENIG) | 3--6um | / | ||
| Gold thickness (ENEPIG) | 0.05--0.1um | / | ||
| Palladium thickness (ENEPIG) | 0.05--0.15um | / | ||
| Nickel thickness(ENEPIG) | 3--6um | / | ||
| Electrolytic Nickel thickness | 3--6um | / | ||
| Electrolytic Gold thickness | 0.05--0.1um | / | ||
| Hard gold thcikness(including lead) | 0.1--1.5um | / | ||
| OSP thickness | 0.1--0.3um | / | ||
| Immersion silver thickness | 0.2--0.4um | / | ||
| Routing | Laser accuracy | ±0.05mm | / | |
| Punch accuracy | ±0.05mm -- ±0.15mm | / | ||