Our assembly facility offers:

    Full turnkey- Prototype, low, medium and high volume quantities

ISO 9001: 2015 & ISO 13485: 2016 certified

Standards: IPC-A-610, J-STD-001, IPC-HDBK-001

Seven complete SMT lines
100K and 10K Clean Rooms

9 modern Electronic Workshops

Reliability Lab

Testing Services

Dedicated workshops for specific customers in support of meeting high-volume programs and dedicated workshops that are set up for high mix - lower volume programs.

Our Assembly Capabilities Include:

Full SMT lines

Leading expertise in placement of components onto board

Hot-Bar soldering

Fine pitch connector of 0.3mm (12mils)

Passive component 0201 (0603)

QFP (quad flat package) / IC / fine pitch (20 mils)

BGA Assembly - smallest pitch 0.25mm

01005 or above - component placement

Selective Wave Solder

ACF/ACP bonding (anisotropic conductive film or paste bonding)

Wire Harness - added to circuit assembly

Sonic welding or other attachment methods and much more…

JS will also design and procure specialized equipment to support overall program requirements if/as needed and more…