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Design & Layout
Introduction:

HighestSignal Speed: 28Gbps
Max 48 Layers Design
Min BGA Pin-Pith: 0.4mm
Min Line width/space: 2.5/2.5mil
Min Hole: 3mil
Max Connections: 30000
Max Pin count : 40000
Max BGAs in one board: 44

 

SIDesign: 28G+ high-speed SI design capability
EMCDesign: FCC,CISPR,VCCI
RF Design & Analysis
HDI Design: Buriedand Blind Via, Via-In-Pad,
Embedded Capacitor & Resistor
FPC Design: 10-layerRigid + 10-layer Flex
Dfx Design: DFM, DFA, DFT, DFC


OtherInfo:
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