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HDI
Introduction:

4 Step HDI Board


Parameter

Layers:    14L4+6+4

Thickness:  1.6mm

Min. Hole Size:   0.10mm

Width/Space:    0.08mm/0.1mm

Surface Treatment:  ENIG

Process

Fourstep unidirectional layer added and stack-up laser holes HDI

Multi-laminationand layer alignment technology

Applications

Aerospace

 

3 Step HDI Board

 


Parameter

Layers:    8

Thickness:   1.2mm

Min. Hole Size:   Via/0.3mm   Blind Via/0.15mm

Width/Space:   0.1mm/0.1mm

Surface Treatment :   ENIG

Process

  Micro-viaStack up

Applications

  Tablet

OtherInfo:
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