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TECHNICAL
SI Design: 28G+ high-speed SI design capability
EMC Design: FCC,CISPR,VCCI
RF Design & Analysis
HDI Design: Buried and Blind Via, Via-In-Pad,
Embedded Capacitor & Resistor
FPC Design: 10-layer Rigid + 10-layer Flex
Dfx Design: DFM, DFA, DFT, DFC


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